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 FEATURES AND SPECIFICATIONS Molex's SLTM (Stackable Linear) compliant-pin header reduces wave-soldering issues for wire-to-board and board-to-board terminations in industrial equipment, telecommunications and automotive applications The SL product family is a modular, single-row, wire-to-wire and wire-to-board system. Developed for versatility, SL headers are intended for applications such as lower power and signal devices including computers, medical instruments and automotive controls. This interconnect system mates with other Molex systems such as the C-Grid (R) and KK (R). The new press-fit headers are an extension of the SL family which offers post reflow/wave soldering on-board termination. This eliminates the need for soldering thus reduces the usual quality issues related to wave soldering. The press-fit termination provides reliable and stable connection onto the PCB and allows easy repair/replacement of the connector to be carried out easily, saving the user valuable time and cost. The press-fit header mates with the 70066 (SLTM ), 70400 (C-Grid(R) ) and 70430 (C-Grid SLTM ) series receptacles. For more information about the SL connector family, please visit: http://www.molex.com/product/cgrid/ Features * 2 to 25 circuits* * Compliant pin press-fit * Low profile design * Stackable * Positive latching Benefits * Allows design flexibility
SLTM (Stackable Linear) Compliant Pin Header 2.54mm (.100") Pitch 74095 Compliant Pin Header
25-Circuit SL Header
* Secures well and maintains retention to PCB and allows post reflow on-board connector termination * Flexibility for compact applications design * Provides a versatile "building block" system * Ensures secure mating of header and receptacle
*Currently, only 25-circuit size is available. Other sizes are upon request.
SPECIIFICATIONS Reference Information Packaging: Tube UL File No.: TBA CSA File No.: TBA Mates With Receptacles: SLTM (Series 70066) C-Grid(R) (Series 70400) C-Grid SLTM (Series 70430) Designed In: Millimeters Electrical Voltage (max.): 250V Current (max.): 3.0A Contact Resistance: 30 milliohms Dielectric Withstanding Voltage: 1500V AC Insulation Resistance: 100 Megohms Mechanical Contact Retention to Housing: 8.9N (2.00lb) Insertion Force to PCB: 106.7N (24.00lb) Retention Force to PCB: 35.6N (8.00lb) Durability (min.): 25 cycles Physical Housing: Black polyester UL 94V-0 Contact: Copper alloy Plating: Contact Area -- See ordering chart below Solder Tail Area -- Tin/Lead (PbSn) Underplating -- Nickel (Ni) overall Recommended PCB Board thickness: 2.36mm (.093") Operating Temperature: 0C to +75C
MARKETS AND APPLICATIONS
Regional Markets, Applications and Typical Customers
SLTM (Stackable Linear) Compliant Pin Header 2.54mm (.100") Pitch 74095 Compliant Pin Header
Industrial Equipment - Remote monitoring systems - Lab equipment - Measurement equipment Telecommunication - Hubs - Servers - routers Automotive - Climate control system - Infotainment system
PCBs in industrial/telecommunication equipments
Telecommunication Servers Infotainment system
ORDERING INFORMATION Description SLTM (Stackable Linear) Compliant Pin Header 2.54mm (.100") Pitch Order No. 74095-0025 74095-0055 74095-0085 Contact Area Plating Tin 15u" Gold 30u" Gold 25 Circuits Plant No. for Samples 1399 (APS) 5102 (Europe) 3109 (Americas)
Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com
Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com
Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com
European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com
Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550
Visit our Web site at http://www.molex.com
SAP No. 9876502792 (c)2009, Molex


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